Halvleder-mikrochip: Forskelle mellem versioner

En '''halvleder-mikrochip''' eller '''halvlederbrik'''<ref>Halvlederbrik anvendt her: [https://ing.dk/artikel/storre-lagerchip-kraever-ny-teknik-3359 28. feb 1986, ing.dk: Større lagerchip kræver ny teknik] Citat: "... En DRAM (Dynamic Ramdom Access Memory) er den form for halvlederbrik (chip), der udgør arbejdslageret i praktisk taget alle datamaskiner fra lommeregnere til superdatamater...", [https://web.archive.org/web/20140315160614/https://ing.dk/artikel/storre-lagerchip-kraever-ny-teknik-3359 backup]</ref> (kortere '''mikrochip''', '''chip'''; engelsk: '''''Die'''''<ref>[https://www.pcmag.com/encyclopedia/term/die pcmag.com: Die] Citat: "...An unpackaged, bare chip...The terms die and chip are often used synonymously...", [https://web.archive.org/web/20210316202450/https://www.pcmag.com/encyclopedia/term/die backup]</ref><ref>Graham Neil: ''[https://siliconsemiconductor.net/article/68175/Time_Is_Right_For_Bare_Die Time is right for bare die.]'' In: ''European Semiconductor.'' 27, Nr.&nbsp;11, 2005, Seiten 11–12: Citat: "...The technology has made significant advances over the years, however the fact remains that the actual silicon Die in the package is much smaller, lighter and has less mass than a packaged part itself...", [https://web.archive.org/web/20210429210521/https://siliconsemiconductor.net/article/68175/Time_Is_Right_For_Bare_Die backup]</ref>) er indenfor [[halvlederteknologi]] betegnelsen for selve halvlederkomponenten uden [[indpakningHus (halvleder)|hus]] eller hus. En '''halvleder-skive''' (eng. '''''wafer''''', '''''siliciumwafer''''') skæres med en diamant og brækkes op til de små halvleder-mikrochips efter endt forarbejdning (bl.a. litografi [[dotering]], [[metalisering]]...).